Job Product Lead - Advanced Semiconductor (3303-1) Santa Clara, CA

Product Lead - Advanced Semiconductor (3303-1) Santa Clara, CA

Job Poster : [email protected]

Skills:Product Lead - Advanced Semiconductor       |  Location: Santa Clara, CA  ,  California  ,  United States Of America

Views:95

Product Lead - Advanced Semiconductor (3303-1) Santa Clara, CA

ASIC design, semiconductor electronics, mixed-signal, chiplet design, advanced packaging, chiplet integration, high-speed chiplet, signal & power integrity

 If you post this job on a job board, please do not use company name or salary.
 Experience level: Mid-senior Experience required: 9 Years Education level: Bachelor’s degree Job function: Information Technology Industry: Information Technology and Services Pay rate : View hourly payrate Total position: 1 Relocation assistance: No Visa sponsorship eligibility: No
JOB DESCRIPTION

Product Lead - Advanced Semiconductor Packaging and Integration

Position Overview:
We are seeking a highly experienced candidate with a robust background in Advanced Semiconductor Electronics and ASIC Design. The ideal candidate will possess extensive knowledge in mixed-signal design, chiplet design, and advanced packaging. This role demands a deep understanding of both BEOL and FEOL semiconductor processing, as well as current packaging and substrate technologies for advanced packaging.

Responsibilities:

Lead the product development lifecycle for cutting-edge semiconductor electronics and ASICs.
Collaborate with cross-functional teams to innovate and integrate mixed-signal and chiplet designs.
Drive advancements in chiplet integration and high-speed chiplet I/O.
Ensure signal and power integrity throughout the design and implementation phases.
Stay abreast of the latest trends and technologies in advanced packaging and semiconductor processing.
Requirements:

Bachelors or Masters degree in Electrical Engineering, Computer Engineering, or a related field.
At least 10 years of experience in semiconductor electronics and ASIC design.
Proficiency in mixed-signal design and chiplet design.
In-depth knowledge of advanced packaging, BEOL and FEOL semiconductor processing.
Experience with current packaging technologies and substrate technologies for advanced packaging.
Strong expertise in chiplet integration and high-speed chiplet I/O.
Proven track record in ensuring signal integrity and power integrity in complex designs.
Collaborate with cross-functional teams to ensure seamless integration and timely delivery of projects.
Mentor and guide junior engineers, fostering a culture of continuous learning and innovation.


Preferred Qualifications:

Ph.D. in a relevant field.
Experience with leading industry-standard design and simulation tools.
Published works or patents in semiconductor technologies.
Excellent leadership, communication, and project management skills.

Save me for future

Report / Flag this Job Ad

General Job Safety Alert

Before applying to any job, be aware of these common scam warning signs
  • Requests for payment, bank details, or financial information
  • Unusually high salaries for minimal qualifications
  • Job offers without proper interviews
  • Requests to transfer money or cash checks
  • Communications with poor grammar/spelling
  • Pressure to make immediate decisions

Never share sensitive personal or financial information without verification. If you encounter suspicious activity, please report it immediately. Read our full scam prevention guidelines.



Check Similar Jobs